Tin/Lead alloy: Sn/Pb and Sn/Pb/Ag series
| Paste flu | Paste flux type | Application | Characteristics | |
| EMCO#501 | No-clean | Halogen-free | printing/dispensing | Excellent wettability and printing performance, suitable for mounting and soldering of fine pitch devices |
EMCO#218 | No-clean | Halogen | printing/dispensing | Excellent soldering performance, anti-collapse ability, excellent heat resistance, suitable for LED welding |
High lead alloy: Sn/Pb/Ag ( Pb>85) series
| Paste flux | Paste flux type | Application | Characteristics | |
| EMCO#150 | No-clean | Halogen-free | printing/dispensing | Used for power semiconductor packaging soldering such as power tubes, diodes, triodes, rectifier bridges, small integrated circuits, etc.Extremely low void rate, residues can be easily cleaned |
Halogen-free: According to IEC (International Electrotechnical Commission) 61249-2-21 and IPC (the Institute of Printed Circuits) 4101B specifications, products that meet the following standards are halogen-free.
Chlorine (Cl) content: 0.09wt% (900ppm) or less,
Bromine (Br) content: 0.09wt% (900ppm) or less,
Total chlorine and bromine content: 0.15wt% (1500ppm) or less
For more information , please contact us
Scanning code
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