Tin-silver/Tin-silver-copper alloy (high silver alloy):
During the lead-free transition process, due to the excellent reliability and fatigue resistance of Tin-silver/Tin-silver-copper alloy (high silver alloy), this alloy has become a conventional alloy choice in electronic assembly, and the most commonly used is SAC305.
Electroloy's Tin-silver/Tin-silver-copper alloy complies with IPC/JEDEC/ROHS/REACH lead-free alloy control standards.
Low-silver/silver-free alloys:
Compared with SAC (high-silver) alloys, low-silver/silver-free alloys maintain good soldering performance and have the advantage of cost saving.
Electroloy's low-silver/silver-free alloys comply with IPC/JEDEC/ROHS/REACH lead-free alloy control standards.
High melting point alloy:
Tin-antimony alloy has a higher melting point than conventional lead-free solder alloys and maintains good soldering performance, which is recognized in the high-temperature packaging industry.
Electroloy's high melting point alloy complies with IPC / JEDEC / ROHS / REACH lead-free alloy control standards.
Low melting point alloys:
Low melting point alloys can meet the needs of temperature-sensitive processes and industries with special requirements on alloy melting points. The melting point temperature range is 118-180°C. Electroloy's special flux formula is used in conjunction with SnBi alloys to provide excellent wettability and solder joint reliability.
Electroloy's high melting point alloys comply with IPC / JEDEC / ROHS / REACH lead-free alloy control standards.
Tin-lead alloy:
Tin-lead alloy has better soldering reliability and fatigue resistance than lead-free alloy. Electroloy's tin-lead alloy continues to be used in fields and industries where lead-free solder cannot be replaced and where certain soldering performance requirements are required.
For more information, please contact us
Scanning code
Code public account