Low solid no-clean flux
| Product Code | Type | Characteristics | |
| EM3038R-L | No-clean | Halogen-free | Good wettability, low solid content, no-clean. Suitable for flux foaming, spray and dip soldering processes.Suitable for wide range of PBCA application |
| EM3030R-L | No-clean | Halogen | |
| EM3053R-L2 | No-clean | Halogen | |
| EM5585HF | No-clean | Halogen-free | |
Rosin based flux
| Product Code | Type | Characteristics | |
| EM3155R-L | No-clean | Halogen | Excellent wettability, high solid content, can also be used for no-cleaning. Usually used in foaming and dip soldering processes. |
| EM3115R-L | No-clean | Halogen | |
Water soluble flux
| Product Code | Type | Characteristics | |
| EM2021AHF-L | Water solubale | Halogen-free | Excellent wettability, very low ionized impurities., suitable for dip soldering, effective for copper alloy and nickel-based materials. |
| EM2116-L | Water soluble | Halogen | Neutral PH, excellent wettability for no bridging and soldering defects requirement , easy cleaning with very few ionized impurities. |
Solar flux
| Product Code | Type | Characteristics | |
| EM3023-L | No-clean | Halogen | A low solids flux formulated with an enhanced non-halide activator system that leaves a cleaner post-flux residue than most no-clean fluxes in terms of appearance. This formula is designed for solar applications in photovoltaic modules (PV) |
| EM5552 | No-clean | Halogen-free | |
Halogen-free: According to IEC (International Electrotechnical Commission) 61249-2-21 and IPC (the Institute of Printed Circuits) 4101B standards, the following standards are met and it is considered halogen-free.
Chlorine (Cl) content: 0.09wt% (900ppm) or less,
Bromine (Br) content: 0.09wt% (900ppm) or less,
Total chlorine and bromine content: 0.15wt% (1500ppm) or less
For more information, please contact us
Scanning code
Code public account
