01The composition of solder paste
High-density interconnect (HDI) substrates are increasingly favored in modern electronic devices due to their ability to support more complex designs and circuit density, making devices smaller, lighter, and more powerful. When soldering on such high-precision substrates, selecting the appropriate solder paste is particularly important it directly affects the soldering quality and the reliability of the product. Composition of Solder Paste: Solder paste is primarily composed of metal powders (tin) and flux. For HDI substrates, it is recommended to use fine-grained metal powders (such as Type5 or finer powders) because provide better printing resolution and lower risk of bridging. Additionally, lead-free solder pastes have become the standard choice for many high-end applications due to their environmentalliness and melting characteristics.
02The relevant properties of solder paste
Viscosity and Printability The viscosity of solder paste is critical to its performance during the printing process. High-density interconnect (H) substrates require solder paste to have excellent printability to ensure that it can be accurately printed on tiny pads without overflowing or tilting. Choosing solder paste with viscosity can avoid issues such as voids or bridging during printing. Melting and Wetting Properties When selecting solder paste, its melting temperature and wetting should also be considered. HDI substrates often contain multiple layers of fine circuits, necessitating the solder paste to quickly melt at lower temperatures and evenly wet each joint to minimize thermal stress on the board. Good wetting properties ensure that the solder joints rapidly form strong metal connections after melting, enhancing the mechanical strength and electrical of the welds.
03No cleaning agents or residue control
Due to the complexity and density of HDI substrates, post-soldering cleaning can be extremely difficult. Therefore, it is important to choose a highly reliable no-clean solder paste that leaves minimal corrosive residue after curing, has a negligible impact on electrical performance, and can simplify the manufacturing and reduce cleaning costs. Finally, the selection of solder paste should also consider compatibility with the substrate material. Due to the diversity of HDI substrate materials, the paste needs to be compatible with the substrate material and other assembly materials such as dielectric paste, to ensure that there will be no chemical reactions leading to reliability issues the entire manufacturing process. As a company that can provide our customers with a "complete soldering solution", Altura has been producing and supplying electronic soldering materials For 47 years, Altura has insisted on making solder products, turning focus into expertise, and establishing itself as an expert in one-stop soldering solutions the industry. In the future, we will continue to work hard and strive to better serve our customers!
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